Prior Information Notice – RF On-Wafer Probe Station
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The Ferdinand-Braun-Institut (FBH) plans to procure an automated RF on-wafer probing system within the framework of the EU-funded APECS programme. The system will be used for electrical characterisation of semiconductor devices, circuits and demonstrators at wafer level. It is intended to enable high-frequency and mmWave measurements under controlled and reproducible conditions. The equipment shall support automated probing of wafers up to 200 mm in diameter and provide a versatile platform for a wide range of RF measurements. It will be installed in a cleanroom environment and integrated into existing measurement and process workflows. The procurement procedure is planned for 2026.
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The Ferdinand-Braun-Institut (FBH) plans to procure an automated RF on-wafer probing system within the framework of the EU-funded APECS programme. The system will be used for electrical characterisation of semiconductor devices, circuits and demonstrators at wafer level. It is intended to enable high-frequency and mmWave measurements under controlled and reproducible conditions. The equipment shall support automated probing of wafers up to 200 mm in diameter and provide a versatile platform for a wide range of RF measurements. It will be installed in a cleanroom environment and integrated into existing measurement and process workflows. The procurement procedure is planned for 2026.